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2020 Annual Report
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Institute of Advanced Packaging

Main R&D Areas:

Package system design and simulation, testing technology

Wafer-level packaging technology and assembly technology

Packaging substrate technology


Contact Info:

Kelaiti XIAO

0510-66679379

kexiao@ncap-cn.com

http://www.ncap-cn.com/contact/

Building D1, China Sensor Network International Innovation Park, 200 Linghu Boulevard, Wuxi, Jiangsu Province


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半导体所大楼东侧

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半导体所大楼南侧正门

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半导体所实验室


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