Institute of Advanced Packaging

Institute of Advanced Packaging

Director: Dr. Liqiang Cao, liqiangcao@ncap-cn.com

National Center for Advanced Packaging Co., Ltd

The Institute of Advanced Packaging was founded in September 2012, which became a member institute of JITRI in September 2015. And it is supported by Institute of Microelectronics of Chinese Academy of Sciences and the Administrative Committee of Wuxi Hi-new Tech Industrial Development Zone Science & Technology Bureau. It now has staff of 150. The institute also has research equipment of RMB 298 million, including 12-inch wafer bumping line, laminate package assembly with SMT, CP & FT testing facility and etc. The institute provided technical services for more than 130 enterprises. And annual R&D fund is about RMB 62 million.

R&D fields

Chip package & system design and simulation and testing technology

Wafer-level bumping and FC assembly technology

2.5D/3D integrated packaging technology

Wafer-level packaging and fan-out packaging technology

Dr. Peng Sun

Building D1, China Sensor Network International Innovation Park, 200 Linghu Boulevard, Wuxi




Contact us

  • Address : No. 699 Xuanwu Avenue, Nanjing, China
  • Telephone : +86-25-83455189
  • Fax : +86-25-83455109
  • Email : rdd@jitri.org
Scroll to Top