Institute of Advanced Packaging
Director: Dr. Liqiang Cao, email@example.com
National Center for Advanced Packaging Co., Ltd
The Institute of Advanced Packaging was founded in September 2012, which became a member institute of JITRI in September 2015. And it is supported by Institute of Microelectronics of Chinese Academy of Sciences and the Administrative Committee of Wuxi Hi-new Tech Industrial Development Zone Science & Technology Bureau. It now has staff of 150. The institute also has research equipment of RMB 298 million, including 12-inch wafer bumping line, laminate package assembly with SMT, CP & FT testing facility and etc. The institute provided technical services for more than 130 enterprises. And annual R&D fund is about RMB 62 million.
Chip package & system design and simulation and testing technology
Wafer-level bumping and FC assembly technology
2.5D/3D integrated packaging technology
Wafer-level packaging and fan-out packaging technology